Electronics: Avoid Damages Due to Overheating
Background:
Reliable electronics require careful thermal management during design to ensure thermally induced stresses do not cause failures and to avoid throttling control performance impacts. Predicting component junction temperatures, temperature gradients, and temperature cycles in operation is typically performed with electronics cooling CFD tools, to model heat transfer and fluid flow.
Who Should Attend?
- Electronic Engineers
- Thermal/CFD Engineering
- Electronics Product Managers
Post the session, the participants will be able to:
- Create a detailed electronic cooling CFD model using MCAD and ECAD data.
- Generate a 3D, CAD-based, detailed package thermal model quickly.
- Evaluate component junction temperatures and PCB trace temperatures + understanding airflow.
ON-DEMAND
Amit Nandi has a total of 5+ years of work experience in the Demonstration of Technical Simcenter 3D. Training customers on product usage and Troubleshooting. He is a responsible end to end Technical Support (Post-sales) to Simcenter (Simcenter 3D) & FEMAP to all types of customers (Auto, Aero, Defence, Space, Consumers, Electronics, Marine, etc…).
