Optimise Electronics Cooling with FloEFD in Solid Edge
Join PROLIM for a live Tech Talk to explore how Solid Edge FloEFD revolutionizes thermal simulation for electronics and LED systems. Discover how this CAD-embedded CFD tool empowers engineers to tackle thermal challenges early in the design phase—reducing prototypes and enhancing product reliability. This session covers practical modeling strategies to improve electronics cooling. Learn to simulate real-world features such as heat pipes, contact resistance, and multi-layer PCBs. We’ll demonstrate how to model ventilation with perforated plates and assign resistor components with power dissipation. Then, shift focus to LED module design, where FloEFD helps identify hot spots and evaluate cooling using natural convection, radiation, and material properties.
| Title | Description |
|---|---|
| Electronics Cooling Basics | How FloEFD enables early thermal analysis in PCB designs. |
| Modeling Essentials | Simulate resistors, heat pipes, and airflow through vents. |
| PCB & Junction Resistance | Techniques for accurate board-level thermal modeling. |
| LED Module Simulation | Improve LED reliability with smart cooling analysis. |
| Real-World Example | Case study on optimizing a compact electronics system. |
Pratik is an Application Engineer for Solid Edge and Simcenter 3D at PROLIM. He graduated from Michigan Technological University with a Master of Science degree, specializing in Design and FEA.