As aerospace and defense electronics continue to grow in speed, density, and complexity, ensuring reliable PCB performance has become increasingly critical. High-speed designs are highly susceptible to Signal Integrity (SI), Power Integrity (PI), and Electromagnetic Interference (EMI) issues, which can lead to functional failures, compliance risks, costly re-spins, and mission delays.

This webinar introduces a simulation-driven design approach that enables engineers to predict real-world PCB behavior early in the design cycle. By performing SI, PI, and EMI analysis before fabrication, teams can eliminate risks upfront, reduce prototype iterations, and achieve first-time-right, mission-ready designs.[/vc_column][/vc_row]

• SI and PI issues caused by high-speed switching, leading to reflections, crosstalk, voltage drops, and timing errors
• EMI generation and susceptibility impacting system compliance and reliability
• Power Distribution Network (PDN) weaknesses causing noise and instability

• Layout inefficiencies resulting in multiple re-spins and extended schedules
• Difficulty identifying high-risk nets, vias, and routing patterns early

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HyperLynx Simulation Suite

• HyperLynx SI
  Detects reflections, crosstalk, impedance mismatches, and timing violations to ensure clean and reliable high-speed signaling.

• HyperLynx PI
  Analyzes PDN behavior including voltage drop, noise, decoupling effectiveness, and target impedance to prevent power-related failures.

• HyperLynx Full-Wave Solver
  Performs full-wave 3D electromagnetic analysis to accurately predict EMI/EMC behavior in complex PCB designs.

Together, these tools enable engineers to validate designs early and achieve first-pass success in demanding aerospace and defense applications.

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• Hardware & System Engineers

• PCB Design Engineers

• PCB Simulation Engineers

• Aerospace & Defense Engineering Teams

• R&D and Product Development Teams

• Engineering Managers & Technical Leads

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