Simcenter Micred Quality Tester evaluates semiconductor package thermal structure to detect manufacturing flaws such as die attach difficulties. It employs precise thermal impedance measurement in conjunction with automated testing equipment.

Precise thermal response measurement to a brief power pulse enables high throughput semiconductor testing, including junction-to-case thermal resistance verification. The junction temperature is measured electrically using the built-in Simcenter Micred T3STER technology. As an IC test handler selects and positions devices for testing, each one is certified for automatic binning using a gold standard thermal impedance curve and predefined bandings of variance.