HLAS offers comprehensive EM simulation tools for PCBs and ICs, covering signal and power integrity with full-wave, hybrid, and quasi-static analyses.

Different design challenges require different electromagnetic modeling approaches to optimize both simulation time and resource usage. The choice of EM solver depends on the size of the structure being modeled and the frequency of interest (FOI).

  • Quasi-Static Analysis: Ideal for smaller structures where the size is less than one-tenth of the wavelength of the FOI. This method performs analysis at DC and a single frequency point, making it suitable for analog circuit parasitic extraction at frequencies around 10 MHz. It’s also an excellent fit for small IC packages operating at moderate speeds.
  • Hybrid Simulation: For larger, planar structures operating at moderate frequencies (up to a few GHz), the hybrid method breaks down the structure into planes and transmission lines, interconnected by vias. This approach is widely used for DDR analysis, where accurately modeling non-ideal return paths is critical for system performance.
  • Full-Wave Simulation: When dealing with high frequencies (typically above 5 GHz), full-wave simulation provides the highest level of accuracy, modeling structures in minute detail. Though resource-intensive, it delivers precise results, with parallel simulation techniques used to speed up the process by distributing the workload across multiple cores.

While 3D electromagnetic simulation is valuable on its own, it’s the broader system-level analysis that ultimately determines a product’s reliability and performance. By integrating with HyperLynx Signal Integrity (SI) and Power Integrity (PI) workflows, HyperLynx Advanced Solvers provide a holistic view of interconnect modeling and system behavior.

This integration allows for highly accurate DDR interface analysis, high-speed serial channel evaluation, and advanced AC power integrity studies. PCB models are extracted and simulated automatically within these flows, offering a smooth and highly efficient system-level approach. With HyperLynx, you can start with a proven, ready-to-use flow or customize it to meet your specific needs.

3D electromagnetic simulations are notoriously demanding on both memory and computational resources. HyperLynx Advanced Solvers address this challenge with scalable performance options. You can boost solver efficiency by either adding more CPU cores or distributing simulation tasks across multiple machines.

HLAS Job Distribution (HLAS JD) enables large simulations to run in parallel across your local network. This built-in job manager handles task distribution automatically and integrates with widely used load management systems, making large-scale simulations faster and more efficient.

HyperLynx Advanced Solvers also offer two levels of automated design optimization to help engineers quickly pinpoint the design changes that will lead to the best performance:

  • HyperLynx 3D Explorer (3DEX): Designed for applications with a manageable number of design permutations (<100), 3DEX automates swept-parameter analysis of BGA breakouts, cables, and single-ended or differential traces and vias. Users can extract portions of routed designs, parameterize them, and run simulations on all possible design variations, or manually select the most relevant cases to simulate.
  • HyperLynx Design Space Exploration (DSE): For larger design spaces with more than 100,000 possible permutations, DSE leverages HEEDS-MDO, a powerful optimization suite. It uses the SHERPA algorithm to intelligently explore large design spaces, often finding optimal solutions with a fraction of the required simulations. This makes it ideal for complex, high-dimensional design challenges.